Integration of 2D materials for high-volume semiconductor manufacturing

Purpose and goal:

Layered materials with thicknesses on the atomic scale (2D materials) promise to revolutionize sensing, photonics, and electronics. However, without a viable integration technology for manufacturing on industrial scale they will never deliver the great potential they hold. Our technology promises a solution to this problem.

The goal of this project is to mature and demonstrate our technology for integrating 2D materials with conventional semiconductor substrates, to the level needed for deployment in semiconductor foundries. Expected results and effects:

In the long-run, we see the activities in the project as important steps towards the application of 2D materials in functional components, opto-electronics, and logic circuits, which are innovations that will be a strategic advantage for the Swedish high-tech industry in the future. Approach and implementation:

We will mature technology to the level that it can be used in semiconductor foundries, which are the intended application environment. We will work towards commercialization of our technology by (1) developing relevant technology demonstrators, (2) conceptualizing a product portfolio, and (3) validating the market fit in a dialogue with industrial lead-users.