High-density quantum processor connectivity

Purpose and goal:

The purpose and goal of the project was to develop a concept for microwave packaging of quantum chips that is able to scale from hundreds to thousands of signal lines. The concept also had enable mounting of the chip in an easy and time-efficient manner, while providing state-of-the-art connectivity performance.

Expected results and effects:

The result of the project was a MVP of the proposed koncept. The results have laid a foundation to a functioning solution and a prototype that we will continue iterating on in order to create a final products. This is also the expected effect of the project. Approach and implementation:

The project consisted of electrical development and validation, mechanical development and validation, as well as investigations and establisihing relevant manufacturing processes. The list of requirements was valiated externally and iterated during the project. The completion of the project went well, although prototyping took longer time than expected, for eaxample due to long lead times on material.

The concepts were validated continously upon each iteration, which led to very valuable insight early in the development phase.