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| Funder | Vinnova |
|---|---|
| Recipient Organization | Uppsala University |
| Country | Sweden |
| Start Date | Nov 18, 2022 |
| End Date | Nov 17, 2023 |
| Duration | 364 days |
| Number of Grantees | 1 |
| Roles | Principal Investigator |
| Data Source | Swedish Research Council |
| Grant ID | 2022-03108_Vinnova |
Purpose and goal:
The aim is to transfer the researchers´ know-how in circuit board technology for stretchable electronics to Mycronic´s digital surface mount technology platform for assembly of circuits.
The goal is to develop a manufacturing process for surface-covering substrates of biodegradable material and with it manufacture a biometric patch based on a previously developed two-layer manufacturing process. Reuse and recycling of electronic components and materials must be tested for the biometric patch.
We met the aim but not the goal. Expected results and effects:
Today, we can print and encapsulate conductive structures of composites of liquid metal and biopolymer, with biopolymer as carrier. We have also taken the first step in creating processes for the recycling and reuse of materials, but this has not been tested.
The project and its results are expected to contribute to an increased understanding and a future production of more durable electronic disposable products with biopolymer materials. Both parties are very satisfied with the project and we will continue it with other funding. Approach and implementation:
The project was carried out with stays at Mycronic continuously during the year. In order to carry out the activities, additional project funds were budgeted for by both partners. Monthly follow-up meant that the project could be controlled and receive support by people with other skills in or outside the project.
The biodegradable substrate could be replicated very quickly and the project early on got a focus on the digital production of the material, where several unexpected problems arose which meant that the project did not fulfill its objective, albeit its aim.
Uppsala University
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