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Completed PROJECT GRANT Swedish Research Council

Cocoon Airbag Protection

3M kr SEK

Funder Vinnova
Recipient Organization Unknown
Country Sweden
Start Date Nov 01, 2023
End Date Mar 01, 2024
Duration 121 days
Number of Grantees 1
Roles Principal Investigator
Data Source Swedish Research Council
Grant ID 2023-02261_Vinnova
Grant Description

Purpose and goal: ** Denna text är maskinöversatt **

The purpose of the proposed project was to productize Cocoon by developing an electronics design. The result is a prototype in the intended form factor and with the intended minimum functionality to test and demonstrate the technology in a real way. The goal of demonstrating the electronics in the form of a full-scale prototype with an electronics unit has been fulfilled and within the framework of the project, circuit boards together with associated firmware have successfully been developed.

Expected results and effects:

The Deliverables are three mounted boards with firmware adjusted to fit a 3d-printed shell for electronic housing. The code is designed with control and safety in mind. The MVP is today too expensive for production but it has been developed so that changes can easily be made towards a finished product.

The electronic unit has successfully been developed with a minor adjustment to a new form factor and we can now test it as a whole system. We expect this significant TRL advancement to have many positive effects such as attracting new investments and opening up the possibilities for EU grants. Approach and implementation:

The team consisted of resources from the two companies Cocoon Airbag Protection & Sigma Lundinova. In parallel with an agile project model with periodic decisions in connection with Design Review meetings, a risk management document was kept. By bringing together Cocoon’s in-depth knowledge about the subject & Lundinova’s experience of electronics, we completed the aimed KPIs, as follows:

Documented electronics construction. Construction adapted to intended form factor Three sets of working electronics Firmware developed to the level that Boards Support Package (BSP) exists.

All Grantees

Unknown

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