Thermally conducting paper substrates

Purpose and goal:

Flexible electronics is electronics built on flexible substrates. Flexible electronic systems include energy harvester, energy storage, Si-microprocessors, displays and sensors. One issue encountered is that thermal degradation of the materials and devices by the heat produced by the Si-microprocessors.

There is a need of a novel dielectric flexible substrate of high thermal conductivity to discard the heat away and solve the degradation problems. In “2D-Paper”, we combine the 2D-materials and nanocellulose to create thermally conducting paper substrates. Expected results and effects:

Following the rise of flexible electronics, "2D-Paper" addresses heat management issues in flexible electronics. The global market for flexible electronics is projected to reach $44.8 billion by 2026. The "2D-Paper" proposes a new green and flexible substrate, which is cost-effective, environmentally friendly, recyclable.

It is a superior alternative to traditional substrates. "2D-Paper" has potential impacts on the manufacturing sector, research and development, design, engineering, and recycling, creating new job opportunities and promoting eco-friendly practices. Approach and implementation:

In 2D-Paper, we optimize the technical performance, the composition, fabrication methods, and morphology. The focus includes liquid dispersion control, fabrication of free-standing layers. We measure mechanical properties (tensile strength, bending radius up, bending cycles), dielectric properties (discharged energy density, breakdown strength), and thermal properties (conductivity, diffusivity, specific heat). Life cycle analysis (LCA) comparing 2D-Paper with traditional paper substrates will be conducted.